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C12900 Copper vs. C96400 Copper-nickel

Both C12900 copper and C96400 copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C12900 copper and the bottom bar is C96400 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 2.8 to 50
25
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
51
Tensile Strength: Ultimate (UTS), MPa 220 to 420
490
Tensile Strength: Yield (Proof), MPa 75 to 380
260

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
260
Melting Completion (Liquidus), °C 1080
1240
Melting Onset (Solidus), °C 1030
1170
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 380
28
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
5.0
Electrical Conductivity: Equal Weight (Specific), % IACS 98
5.1

Otherwise Unclassified Properties

Base Metal Price, % relative 32
45
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.9
Embodied Energy, MJ/kg 41
87
Embodied Water, L/kg 330
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 88
100
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 640
250
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 6.8 to 13
15
Strength to Weight: Bending, points 9.1 to 14
16
Thermal Diffusivity, mm2/s 110
7.8
Thermal Shock Resistance, points 7.8 to 15
17

Alloy Composition


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Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Carbon (C), % 0
0 to 0.15
Copper (Cu), % 99.88 to 100
62.3 to 71.3
Iron (Fe), % 0
0.25 to 1.5
Lead (Pb), % 0 to 0.0040
0 to 0.010
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0 to 0.050
28 to 32
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 0 to 0.054
0
Sulfur (S), % 0
0 to 0.020
Tellurium (Te), % 0 to 0.025
0
Residuals, % 0
0 to 0.5