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C14500 Copper vs. ASTM Grade HG10 MNN Steel

C14500 copper belongs to the copper alloys classification, while ASTM grade HG10 MNN steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C14500 copper and the bottom bar is ASTM grade HG10 MNN steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 12 to 50
23
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 43
77
Tensile Strength: Ultimate (UTS), MPa 220 to 330
590
Tensile Strength: Yield (Proof), MPa 69 to 260
250

Thermal Properties

Latent Heat of Fusion, J/g 210
290
Maximum Temperature: Mechanical, °C 200
990
Melting Completion (Liquidus), °C 1080
1420
Melting Onset (Solidus), °C 1050
1370
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 360
15
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 94
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 95
2.5

Otherwise Unclassified Properties

Base Metal Price, % relative 33
21
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 2.6
4.0
Embodied Energy, MJ/kg 42
58
Embodied Water, L/kg 310
160

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 36 to 85
110
Resilience: Unit (Modulus of Resilience), kJ/m3 21 to 300
160
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 6.8 to 10
21
Strength to Weight: Bending, points 9.1 to 12
20
Thermal Diffusivity, mm2/s 100
3.9
Thermal Shock Resistance, points 8.0 to 12
13

Alloy Composition

Carbon (C), % 0
0.070 to 0.11
Chromium (Cr), % 0
18.5 to 20.5
Copper (Cu), % 99.2 to 99.596
0 to 0.5
Iron (Fe), % 0
57.9 to 66.5
Manganese (Mn), % 0
3.0 to 5.0
Molybdenum (Mo), % 0
0.25 to 0.45
Nickel (Ni), % 0
11.5 to 13.5
Niobium (Nb), % 0
0.2 to 1.0
Nitrogen (N), % 0
0.2 to 0.3
Phosphorus (P), % 0.0040 to 0.012
0 to 0.040
Silicon (Si), % 0
0 to 0.7
Sulfur (S), % 0
0 to 0.030
Tellurium (Te), % 0.4 to 0.7
0