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C14500 Copper vs. EN 1.4669 Stainless Steel

C14500 copper belongs to the copper alloys classification, while EN 1.4669 stainless steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C14500 copper and the bottom bar is EN 1.4669 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 12 to 50
28
Poisson's Ratio 0.34
0.27
Shear Modulus, GPa 43
78
Shear Strength, MPa 150 to 190
500
Tensile Strength: Ultimate (UTS), MPa 220 to 330
780
Tensile Strength: Yield (Proof), MPa 69 to 260
450

Thermal Properties

Latent Heat of Fusion, J/g 210
290
Maximum Temperature: Mechanical, °C 200
1030
Melting Completion (Liquidus), °C 1080
1420
Melting Onset (Solidus), °C 1050
1370
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 360
15
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 94
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 95
2.5

Otherwise Unclassified Properties

Base Metal Price, % relative 33
13
Density, g/cm3 8.9
7.7
Embodied Carbon, kg CO2/kg material 2.6
2.6
Embodied Energy, MJ/kg 42
38
Embodied Water, L/kg 310
160

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 36 to 85
190
Resilience: Unit (Modulus of Resilience), kJ/m3 21 to 300
510
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 6.8 to 10
28
Strength to Weight: Bending, points 9.1 to 12
24
Thermal Diffusivity, mm2/s 100
4.0
Thermal Shock Resistance, points 8.0 to 12
21

Alloy Composition

Carbon (C), % 0
0 to 0.045
Chromium (Cr), % 0
21.5 to 24
Copper (Cu), % 99.2 to 99.596
1.6 to 3.0
Iron (Fe), % 0
65.2 to 74.8
Manganese (Mn), % 0
1.0 to 3.0
Molybdenum (Mo), % 0
0 to 0.5
Nickel (Ni), % 0
1.0 to 3.0
Nitrogen (N), % 0
0.12 to 0.2
Phosphorus (P), % 0.0040 to 0.012
0 to 0.040
Silicon (Si), % 0
0 to 1.0
Sulfur (S), % 0
0 to 0.030
Tellurium (Te), % 0.4 to 0.7
0