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C15500 Copper vs. CC383H Copper-nickel

Both C15500 copper and CC383H copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C15500 copper and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 3.0 to 37
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
52
Tensile Strength: Ultimate (UTS), MPa 280 to 550
490
Tensile Strength: Yield (Proof), MPa 130 to 530
260

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
260
Melting Completion (Liquidus), °C 1080
1180
Melting Onset (Solidus), °C 1080
1130
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 350
29
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 90
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 91
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 33
44
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.7
Embodied Energy, MJ/kg 42
83
Embodied Water, L/kg 360
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 15 to 84
84
Resilience: Unit (Modulus of Resilience), kJ/m3 72 to 1210
250
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.6 to 17
15
Strength to Weight: Bending, points 11 to 17
16
Thermal Diffusivity, mm2/s 100
8.1
Thermal Shock Resistance, points 9.8 to 20
17

Alloy Composition


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Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 99.75 to 99.853
64 to 69.1
Iron (Fe), % 0
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Magnesium (Mg), % 0.080 to 0.13
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0.040 to 0.080
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Silver (Ag), % 0.027 to 0.1
0
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Zinc (Zn), % 0
0 to 0.5
Residuals, % 0 to 0.2
0