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C15500 Copper vs. C82000 Copper

Both C15500 copper and C82000 copper are copper alloys. They have a very high 96% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C15500 copper and the bottom bar is C82000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 3.0 to 37
8.0 to 20
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
45
Tensile Strength: Ultimate (UTS), MPa 280 to 550
350 to 690
Tensile Strength: Yield (Proof), MPa 130 to 530
140 to 520

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 200
220
Melting Completion (Liquidus), °C 1080
1090
Melting Onset (Solidus), °C 1080
970
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 350
260
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 90
45
Electrical Conductivity: Equal Weight (Specific), % IACS 91
46

Otherwise Unclassified Properties

Base Metal Price, % relative 33
60
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.0
Embodied Energy, MJ/kg 42
77
Embodied Water, L/kg 360
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 15 to 84
51 to 55
Resilience: Unit (Modulus of Resilience), kJ/m3 72 to 1210
80 to 1120
Stiffness to Weight: Axial, points 7.2
7.5
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 8.6 to 17
11 to 22
Strength to Weight: Bending, points 11 to 17
12 to 20
Thermal Diffusivity, mm2/s 100
76
Thermal Shock Resistance, points 9.8 to 20
12 to 24

Alloy Composition


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Aluminum (Al), % 0
0 to 0.1
Beryllium (Be), % 0
0.45 to 0.8
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
2.2 to 2.7
Copper (Cu), % 99.75 to 99.853
95.2 to 97.4
Iron (Fe), % 0
0 to 0.1
Lead (Pb), % 0
0 to 0.020
Magnesium (Mg), % 0.080 to 0.13
0
Nickel (Ni), % 0
0 to 0.2
Phosphorus (P), % 0.040 to 0.080
0
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 0.027 to 0.1
0
Tin (Sn), % 0
0 to 0.1
Zinc (Zn), % 0
0 to 0.1
Residuals, % 0 to 0.2
0 to 0.5