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C15900 Copper vs. C68400 Brass

Both C15900 copper and C68400 brass are copper alloys. Both are furnished in the M30 (as hot extruded) condition. They have 62% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C15900 copper and the bottom bar is C68400 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
110
Elongation at Break, % 6.5
18
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 43
41
Shear Strength, MPa 420
330
Tensile Strength: Ultimate (UTS), MPa 720
540
Tensile Strength: Yield (Proof), MPa 240
310

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
130
Melting Completion (Liquidus), °C 1080
840
Melting Onset (Solidus), °C 1030
820
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 280
66
Thermal Expansion, µm/m-K 17
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 48
87
Electrical Conductivity: Equal Weight (Specific), % IACS 49
99

Otherwise Unclassified Properties

Base Metal Price, % relative 30
23
Density, g/cm3 8.8
7.9
Embodied Carbon, kg CO2/kg material 2.8
2.7
Embodied Energy, MJ/kg 45
47
Embodied Water, L/kg 310
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 37
81
Resilience: Unit (Modulus of Resilience), kJ/m3 260
460
Stiffness to Weight: Axial, points 7.2
7.5
Stiffness to Weight: Bending, points 18
20
Strength to Weight: Axial, points 23
19
Strength to Weight: Bending, points 20
19
Thermal Diffusivity, mm2/s 80
21
Thermal Shock Resistance, points 26
18

Alloy Composition


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Aluminum (Al), % 0.76 to 0.84
0 to 0.5
Boron (B), % 0
0.0010 to 0.030
Carbon (C), % 0.27 to 0.33
0
Copper (Cu), % 97.5 to 97.9
59 to 64
Iron (Fe), % 0 to 0.040
0 to 1.0
Lead (Pb), % 0
0 to 0.090
Manganese (Mn), % 0
0.2 to 1.5
Nickel (Ni), % 0
0 to 0.5
Oxygen (O), % 0.4 to 0.54
0
Phosphorus (P), % 0
0.030 to 0.3
Silicon (Si), % 0
1.5 to 2.5
Tin (Sn), % 0
0 to 0.5
Titanium (Ti), % 0.66 to 0.74
0
Zinc (Zn), % 0
28.6 to 39.3
Residuals, % 0
0 to 0.5