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C16200 Copper vs. Solder Alloy 115

C16200 copper belongs to the copper alloys classification, while solder alloy 115 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C16200 copper and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
28
Elongation at Break, % 2.0 to 56
22
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 43
10
Tensile Strength: Ultimate (UTS), MPa 240 to 550
36

Thermal Properties

Latent Heat of Fusion, J/g 210
36
Melting Completion (Liquidus), °C 1080
250
Melting Onset (Solidus), °C 1030
180
Specific Heat Capacity, J/kg-K 380
160
Thermal Conductivity, W/m-K 360
43
Thermal Expansion, µm/m-K 17
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 90
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 90
8.9

Otherwise Unclassified Properties

Base Metal Price, % relative 30
95
Density, g/cm3 9.0
9.9
Embodied Carbon, kg CO2/kg material 2.6
7.8
Embodied Energy, MJ/kg 41
130
Embodied Water, L/kg 310
730

Common Calculations

Stiffness to Weight: Axial, points 7.2
1.6
Stiffness to Weight: Bending, points 18
10
Strength to Weight: Axial, points 7.4 to 17
1.0
Strength to Weight: Bending, points 9.6 to 17
2.4
Thermal Diffusivity, mm2/s 100
27
Thermal Shock Resistance, points 8.7 to 20
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0.7 to 1.2
0 to 0.0050
Copper (Cu), % 98.6 to 99.3
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.2
0 to 0.020
Lead (Pb), % 0
63.4 to 65.5
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
34.5 to 35.5
Zinc (Zn), % 0
0 to 0.0010