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C16500 Copper vs. EN 2.4889 Nickel

C16500 copper belongs to the copper alloys classification, while EN 2.4889 nickel belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C16500 copper and the bottom bar is EN 2.4889 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
200
Elongation at Break, % 1.5 to 53
39
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 43
77
Shear Strength, MPa 200 to 310
490
Tensile Strength: Ultimate (UTS), MPa 280 to 530
720
Tensile Strength: Yield (Proof), MPa 97 to 520
270

Thermal Properties

Latent Heat of Fusion, J/g 210
350
Maximum Temperature: Mechanical, °C 340
1200
Melting Completion (Liquidus), °C 1070
1350
Melting Onset (Solidus), °C 1010
1300
Specific Heat Capacity, J/kg-K 380
480
Thermal Conductivity, W/m-K 250
13
Thermal Expansion, µm/m-K 17
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
1.5
Electrical Conductivity: Equal Weight (Specific), % IACS 61
1.6

Otherwise Unclassified Properties

Base Metal Price, % relative 31
42
Density, g/cm3 8.9
8.0
Embodied Carbon, kg CO2/kg material 2.6
6.9
Embodied Energy, MJ/kg 42
98
Embodied Water, L/kg 320
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 7.8 to 110
220
Resilience: Unit (Modulus of Resilience), kJ/m3 41 to 1160
180
Stiffness to Weight: Axial, points 7.1
14
Stiffness to Weight: Bending, points 18
24
Strength to Weight: Axial, points 8.6 to 17
25
Strength to Weight: Bending, points 11 to 16
22
Thermal Diffusivity, mm2/s 74
3.4
Thermal Shock Resistance, points 9.8 to 19
19

Alloy Composition


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Cadmium (Cd), % 0.6 to 1.0
0
Carbon (C), % 0
0.050 to 0.12
Cerium (Ce), % 0
0.030 to 0.090
Chromium (Cr), % 0
26 to 29
Copper (Cu), % 97.8 to 98.9
0 to 0.3
Iron (Fe), % 0 to 0.020
21 to 25
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0
45 to 50.4
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
2.5 to 3.0
Sulfur (S), % 0
0 to 0.010
Tin (Sn), % 0.5 to 0.7
0
Residuals, % 0 to 0.5
0