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C16500 Copper vs. Grade CW6MC Nickel

C16500 copper belongs to the copper alloys classification, while grade CW6MC nickel belongs to the nickel alloys. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C16500 copper and the bottom bar is grade CW6MC nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
200
Elongation at Break, % 1.5 to 53
28
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 43
79
Tensile Strength: Ultimate (UTS), MPa 280 to 530
540
Tensile Strength: Yield (Proof), MPa 97 to 520
310

Thermal Properties

Latent Heat of Fusion, J/g 210
330
Maximum Temperature: Mechanical, °C 340
980
Melting Completion (Liquidus), °C 1070
1480
Melting Onset (Solidus), °C 1010
1430
Specific Heat Capacity, J/kg-K 380
440
Thermal Conductivity, W/m-K 250
11
Thermal Expansion, µm/m-K 17
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
1.3
Electrical Conductivity: Equal Weight (Specific), % IACS 61
1.4

Otherwise Unclassified Properties

Base Metal Price, % relative 31
80
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 2.6
14
Embodied Energy, MJ/kg 42
200
Embodied Water, L/kg 320
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 7.8 to 110
130
Resilience: Unit (Modulus of Resilience), kJ/m3 41 to 1160
240
Stiffness to Weight: Axial, points 7.1
13
Stiffness to Weight: Bending, points 18
23
Strength to Weight: Axial, points 8.6 to 17
18
Strength to Weight: Bending, points 11 to 16
17
Thermal Diffusivity, mm2/s 74
2.8
Thermal Shock Resistance, points 9.8 to 19
15

Alloy Composition


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Cadmium (Cd), % 0.6 to 1.0
0
Carbon (C), % 0
0 to 0.060
Chromium (Cr), % 0
20 to 23
Copper (Cu), % 97.8 to 98.9
0
Iron (Fe), % 0 to 0.020
0 to 5.0
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
8.0 to 10
Nickel (Ni), % 0
55.4 to 68.9
Niobium (Nb), % 0
3.2 to 4.5
Phosphorus (P), % 0
0 to 0.015
Silicon (Si), % 0
0 to 1.0
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 0.5 to 0.7
0
Residuals, % 0 to 0.5
0