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C16500 Copper vs. C17510 Copper

Both C16500 copper and C17510 copper are copper alloys. They have a very high 97% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C16500 copper and the bottom bar is C17510 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 1.5 to 53
5.4 to 37
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
44
Shear Strength, MPa 200 to 310
210 to 500
Tensile Strength: Ultimate (UTS), MPa 280 to 530
310 to 860
Tensile Strength: Yield (Proof), MPa 97 to 520
120 to 750

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 340
220
Melting Completion (Liquidus), °C 1070
1070
Melting Onset (Solidus), °C 1010
1030
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 250
210
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
22 to 54
Electrical Conductivity: Equal Weight (Specific), % IACS 61
23 to 54

Otherwise Unclassified Properties

Base Metal Price, % relative 31
49
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.6
4.2
Embodied Energy, MJ/kg 42
65
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 7.8 to 110
39 to 92
Resilience: Unit (Modulus of Resilience), kJ/m3 41 to 1160
64 to 2410
Stiffness to Weight: Axial, points 7.1
7.4
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 8.6 to 17
9.7 to 27
Strength to Weight: Bending, points 11 to 16
11 to 23
Thermal Diffusivity, mm2/s 74
60
Thermal Shock Resistance, points 9.8 to 19
11 to 30

Alloy Composition


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Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
0.2 to 0.6
Cadmium (Cd), % 0.6 to 1.0
0
Cobalt (Co), % 0
0 to 0.3
Copper (Cu), % 97.8 to 98.9
95.9 to 98.4
Iron (Fe), % 0 to 0.020
0 to 0.1
Nickel (Ni), % 0
1.4 to 2.2
Silicon (Si), % 0
0 to 0.2
Tin (Sn), % 0.5 to 0.7
0
Residuals, % 0 to 0.5
0 to 0.5