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C17200 Copper vs. ACI-ASTM CB7Cu-2 Steel

C17200 copper belongs to the copper alloys classification, while ACI-ASTM CB7Cu-2 steel belongs to the iron alloys. There are 26 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C17200 copper and the bottom bar is ACI-ASTM CB7Cu-2 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 1.1 to 37
5.7 to 11
Poisson's Ratio 0.33
0.28
Shear Modulus, GPa 45
75
Tensile Strength: Ultimate (UTS), MPa 480 to 1380
960 to 1350
Tensile Strength: Yield (Proof), MPa 160 to 1250
760 to 1180

Thermal Properties

Latent Heat of Fusion, J/g 230
280
Melting Completion (Liquidus), °C 980
1430
Melting Onset (Solidus), °C 870
1380
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 110
17
Thermal Expansion, µm/m-K 18
11

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
2.1
Electrical Conductivity: Equal Weight (Specific), % IACS 23
2.4

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.8
Embodied Carbon, kg CO2/kg material 9.4
2.6
Embodied Energy, MJ/kg 150
38
Embodied Water, L/kg 310
130

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 4.2 to 500
71 to 120
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5720
1510 to 3600
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 15 to 44
34 to 48
Strength to Weight: Bending, points 16 to 31
28 to 35
Thermal Diffusivity, mm2/s 31
4.6
Thermal Shock Resistance, points 16 to 46
32 to 45

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Carbon (C), % 0
0 to 0.070
Chromium (Cr), % 0
14 to 15.5
Copper (Cu), % 96.1 to 98
2.5 to 3.2
Iron (Fe), % 0 to 0.4
73.6 to 79
Manganese (Mn), % 0
0 to 0.7
Nickel (Ni), % 0.2 to 0.6
4.5 to 5.5
Niobium (Nb), % 0
0 to 0.35
Nitrogen (N), % 0
0 to 0.050
Phosphorus (P), % 0
0 to 0.035
Silicon (Si), % 0 to 0.2
0 to 1.0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.5
0