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C17200 Copper vs. C12500 Copper

Both C17200 copper and C12500 copper are copper alloys. They have a very high 97% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C17200 copper and the bottom bar is C12500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 1.1 to 37
1.5 to 50
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 45
43
Shear Strength, MPa 330 to 780
150 to 220
Tensile Strength: Ultimate (UTS), MPa 480 to 1380
220 to 420
Tensile Strength: Yield (Proof), MPa 160 to 1250
75 to 390

Thermal Properties

Latent Heat of Fusion, J/g 230
210
Maximum Temperature: Mechanical, °C 280
200
Melting Completion (Liquidus), °C 980
1080
Melting Onset (Solidus), °C 870
1070
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 110
350
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
92
Electrical Conductivity: Equal Weight (Specific), % IACS 23
93

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 9.4
2.6
Embodied Energy, MJ/kg 150
41
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 4.2 to 500
5.6 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5720
24 to 660
Stiffness to Weight: Axial, points 7.6
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 15 to 44
6.9 to 13
Strength to Weight: Bending, points 16 to 31
9.1 to 14
Thermal Diffusivity, mm2/s 31
100
Thermal Shock Resistance, points 16 to 46
7.8 to 15

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Beryllium (Be), % 1.8 to 2.0
0
Bismuth (Bi), % 0
0 to 0.0030
Copper (Cu), % 96.1 to 98
99.88 to 100
Iron (Fe), % 0 to 0.4
0
Lead (Pb), % 0
0 to 0.0040
Nickel (Ni), % 0.2 to 0.6
0 to 0.050
Silicon (Si), % 0 to 0.2
0
Tellurium (Te), % 0
0 to 0.025
Residuals, % 0 to 0.5
0 to 0.3