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C17300 Copper vs. ASTM A369 Grade FP5

C17300 copper belongs to the copper alloys classification, while ASTM A369 grade FP5 belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is ASTM A369 grade FP5.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 3.0 to 23
20
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 45
74
Shear Strength, MPa 320 to 790
300
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
470
Tensile Strength: Yield (Proof), MPa 160 to 1200
240

Thermal Properties

Latent Heat of Fusion, J/g 230
260
Maximum Temperature: Mechanical, °C 270
510
Melting Completion (Liquidus), °C 980
1460
Melting Onset (Solidus), °C 870
1420
Specific Heat Capacity, J/kg-K 380
470
Thermal Conductivity, W/m-K 110
40
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
8.0
Electrical Conductivity: Equal Weight (Specific), % IACS 23
9.2

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.8
Embodied Carbon, kg CO2/kg material 9.4
1.7
Embodied Energy, MJ/kg 150
23
Embodied Water, L/kg 310
69

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 88
80
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5410
140
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 16 to 44
17
Strength to Weight: Bending, points 16 to 31
17
Thermal Diffusivity, mm2/s 32
11
Thermal Shock Resistance, points 17 to 48
13

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Carbon (C), % 0
0 to 0.15
Chromium (Cr), % 0
4.0 to 6.0
Copper (Cu), % 95.5 to 97.8
0
Iron (Fe), % 0 to 0.4
92.1 to 95.3
Lead (Pb), % 0.2 to 0.6
0
Manganese (Mn), % 0
0.3 to 0.6
Molybdenum (Mo), % 0
0.45 to 0.65
Nickel (Ni), % 0.2 to 0.6
0
Phosphorus (P), % 0
0 to 0.025
Silicon (Si), % 0 to 0.2
0 to 0.5
Sulfur (S), % 0
0 to 0.025
Residuals, % 0 to 0.5
0