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C17300 Copper vs. Grade CW6MC Nickel

C17300 copper belongs to the copper alloys classification, while grade CW6MC nickel belongs to the nickel alloys. There are 27 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is grade CW6MC nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 3.0 to 23
28
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 45
79
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
540
Tensile Strength: Yield (Proof), MPa 160 to 1200
310

Thermal Properties

Latent Heat of Fusion, J/g 230
330
Maximum Temperature: Mechanical, °C 270
980
Melting Completion (Liquidus), °C 980
1480
Melting Onset (Solidus), °C 870
1430
Specific Heat Capacity, J/kg-K 380
440
Thermal Conductivity, W/m-K 110
11
Thermal Expansion, µm/m-K 17
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
1.3
Electrical Conductivity: Equal Weight (Specific), % IACS 23
1.4

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.6
Embodied Carbon, kg CO2/kg material 9.4
14
Embodied Energy, MJ/kg 150
200
Embodied Water, L/kg 310
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 88
130
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5410
240
Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
23
Strength to Weight: Axial, points 16 to 44
18
Strength to Weight: Bending, points 16 to 31
17
Thermal Diffusivity, mm2/s 32
2.8
Thermal Shock Resistance, points 17 to 48
15

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Carbon (C), % 0
0 to 0.060
Chromium (Cr), % 0
20 to 23
Copper (Cu), % 95.5 to 97.8
0
Iron (Fe), % 0 to 0.4
0 to 5.0
Lead (Pb), % 0.2 to 0.6
0
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
8.0 to 10
Nickel (Ni), % 0.2 to 0.6
55.4 to 68.9
Niobium (Nb), % 0
3.2 to 4.5
Phosphorus (P), % 0
0 to 0.015
Silicon (Si), % 0 to 0.2
0 to 1.0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.5
0