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C17300 Copper vs. Solder Alloy 133

C17300 copper belongs to the copper alloys classification, while solder alloy 133 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is solder alloy 133.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
33
Elongation at Break, % 3.0 to 23
34
Poisson's Ratio 0.33
0.4
Shear Modulus, GPa 45
12
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
41

Thermal Properties

Latent Heat of Fusion, J/g 230
42
Melting Completion (Liquidus), °C 980
220
Melting Onset (Solidus), °C 870
180
Specific Heat Capacity, J/kg-K 380
180
Thermal Conductivity, W/m-K 110
47
Thermal Expansion, µm/m-K 17
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
11
Electrical Conductivity: Equal Weight (Specific), % IACS 23
10

Otherwise Unclassified Properties

Density, g/cm3 8.8
9.3
Embodied Carbon, kg CO2/kg material 9.4
9.4
Embodied Energy, MJ/kg 150
160
Embodied Water, L/kg 310
840

Common Calculations

Stiffness to Weight: Axial, points 7.6
2.0
Stiffness to Weight: Bending, points 19
12
Strength to Weight: Axial, points 16 to 44
1.2
Strength to Weight: Bending, points 16 to 31
2.9
Thermal Diffusivity, mm2/s 32
29
Thermal Shock Resistance, points 17 to 48
3.5

Alloy Composition

Aluminum (Al), % 0 to 0.2
0 to 0.0010
Antimony (Sb), % 0
0.2 to 0.5
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 1.8 to 2.0
0
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 95.5 to 97.8
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.4
0 to 0.020
Lead (Pb), % 0.2 to 0.6
48.5 to 50.3
Nickel (Ni), % 0.2 to 0.6
0 to 0.010
Silicon (Si), % 0 to 0.2
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.5
0