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C17300 Copper vs. Solder Alloy 601

C17300 copper belongs to the copper alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
31
Elongation at Break, % 3.0 to 23
83
Poisson's Ratio 0.33
0.41
Shear Modulus, GPa 45
11
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
12

Thermal Properties

Latent Heat of Fusion, J/g 230
43
Melting Completion (Liquidus), °C 980
120
Melting Onset (Solidus), °C 870
120
Specific Heat Capacity, J/kg-K 380
230
Thermal Conductivity, W/m-K 110
34
Thermal Expansion, µm/m-K 17
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
12
Electrical Conductivity: Equal Weight (Specific), % IACS 23
14

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.3
Embodied Water, L/kg 310
1330

Common Calculations

Stiffness to Weight: Axial, points 7.6
2.3
Stiffness to Weight: Bending, points 19
14
Strength to Weight: Axial, points 16 to 44
0.45
Strength to Weight: Bending, points 16 to 31
1.6
Thermal Diffusivity, mm2/s 32
20
Thermal Shock Resistance, points 17 to 48
1.2

Alloy Composition

Aluminum (Al), % 0 to 0.2
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 1.8 to 2.0
0
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 95.5 to 97.8
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
51 to 52.5
Iron (Fe), % 0 to 0.4
0 to 0.020
Lead (Pb), % 0.2 to 0.6
0 to 0.070
Nickel (Ni), % 0.2 to 0.6
0 to 0.010
Silicon (Si), % 0 to 0.2
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
47.5 to 48.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.5
0