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C17465 Copper vs. Solder Alloy 601

C17465 copper belongs to the copper alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is C17465 copper and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
31
Elongation at Break, % 5.3 to 36
83
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 44
11
Tensile Strength: Ultimate (UTS), MPa 310 to 930
12

Thermal Properties

Latent Heat of Fusion, J/g 210
43
Melting Completion (Liquidus), °C 1080
120
Melting Onset (Solidus), °C 1030
120
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 220
34
Thermal Expansion, µm/m-K 17
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22 to 51
12
Electrical Conductivity: Equal Weight (Specific), % IACS 23 to 52
14

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Water, L/kg 310
1330

Common Calculations

Stiffness to Weight: Axial, points 7.3
2.3
Stiffness to Weight: Bending, points 18
14
Strength to Weight: Axial, points 9.7 to 29
0.45
Strength to Weight: Bending, points 11 to 24
1.6
Thermal Diffusivity, mm2/s 64
20
Thermal Shock Resistance, points 11 to 33
1.2

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 0.15 to 0.5
0
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 95.7 to 98.7
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
51 to 52.5
Iron (Fe), % 0 to 0.2
0 to 0.020
Lead (Pb), % 0.2 to 0.6
0 to 0.070
Nickel (Ni), % 1.0 to 1.4
0 to 0.010
Silicon (Si), % 0 to 0.2
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.25
47.5 to 48.5
Zinc (Zn), % 0
0 to 0.0010
Zirconium (Zr), % 0 to 0.5
0
Residuals, % 0 to 0.5
0