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C17465 Copper vs. Nickel 200

C17465 copper belongs to the copper alloys classification, while nickel 200 belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C17465 copper and the bottom bar is nickel 200.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
180
Elongation at Break, % 5.3 to 36
23 to 44
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 44
70
Shear Strength, MPa 210 to 540
300 to 340
Tensile Strength: Ultimate (UTS), MPa 310 to 930
420 to 540
Tensile Strength: Yield (Proof), MPa 120 to 830
120 to 370

Thermal Properties

Latent Heat of Fusion, J/g 210
290
Maximum Temperature: Mechanical, °C 210
900
Melting Completion (Liquidus), °C 1080
1460
Melting Onset (Solidus), °C 1030
1440
Specific Heat Capacity, J/kg-K 390
450
Thermal Conductivity, W/m-K 220
69
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22 to 51
18
Electrical Conductivity: Equal Weight (Specific), % IACS 23 to 52
18

Otherwise Unclassified Properties

Base Metal Price, % relative 45
65
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.1
11
Embodied Energy, MJ/kg 64
150
Embodied Water, L/kg 310
230

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 47 to 90
110 to 150
Resilience: Unit (Modulus of Resilience), kJ/m3 64 to 2920
42 to 370
Stiffness to Weight: Axial, points 7.3
11
Stiffness to Weight: Bending, points 18
21
Strength to Weight: Axial, points 9.7 to 29
13 to 17
Strength to Weight: Bending, points 11 to 24
14 to 17
Thermal Diffusivity, mm2/s 64
17
Thermal Shock Resistance, points 11 to 33
13 to 16

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.15 to 0.5
0
Carbon (C), % 0
0 to 0.15
Copper (Cu), % 95.7 to 98.7
0 to 0.25
Iron (Fe), % 0 to 0.2
0 to 0.4
Lead (Pb), % 0.2 to 0.6
0
Manganese (Mn), % 0
0 to 0.35
Nickel (Ni), % 1.0 to 1.4
99 to 100
Silicon (Si), % 0 to 0.2
0 to 0.35
Sulfur (S), % 0
0 to 0.010
Tin (Sn), % 0 to 0.25
0
Zirconium (Zr), % 0 to 0.5
0
Residuals, % 0 to 0.5
0