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C17500 Copper vs. ASTM Grade HI Steel

C17500 copper belongs to the copper alloys classification, while ASTM grade HI steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C17500 copper and the bottom bar is ASTM grade HI steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 6.0 to 30
11
Fatigue Strength, MPa 170 to 310
150
Poisson's Ratio 0.34
0.27
Shear Modulus, GPa 45
79
Tensile Strength: Ultimate (UTS), MPa 310 to 860
550
Tensile Strength: Yield (Proof), MPa 170 to 760
270

Thermal Properties

Latent Heat of Fusion, J/g 220
310
Maximum Temperature: Mechanical, °C 220
1100
Melting Completion (Liquidus), °C 1060
1400
Melting Onset (Solidus), °C 1020
1350
Specific Heat Capacity, J/kg-K 390
490
Thermal Conductivity, W/m-K 200
15
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 24 to 53
2.1
Electrical Conductivity: Equal Weight (Specific), % IACS 24 to 54
2.4

Otherwise Unclassified Properties

Base Metal Price, % relative 60
23
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 4.7
4.1
Embodied Energy, MJ/kg 73
59
Embodied Water, L/kg 320
200

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 30 to 120
52
Resilience: Unit (Modulus of Resilience), kJ/m3 120 to 2390
180
Stiffness to Weight: Axial, points 7.5
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 9.7 to 27
20
Strength to Weight: Bending, points 11 to 23
19
Thermal Diffusivity, mm2/s 59
3.9
Thermal Shock Resistance, points 11 to 29
12

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.4 to 0.7
0
Carbon (C), % 0
0.2 to 0.5
Chromium (Cr), % 0
26 to 30
Cobalt (Co), % 2.4 to 2.7
0
Copper (Cu), % 95.6 to 97.2
0
Iron (Fe), % 0 to 0.1
46.9 to 59.8
Manganese (Mn), % 0
0 to 2.0
Molybdenum (Mo), % 0
0 to 0.5
Nickel (Ni), % 0
14 to 18
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0 to 0.2
0 to 2.0
Sulfur (S), % 0
0 to 0.040
Residuals, % 0 to 0.5
0