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C17500 Copper vs. Grade CZ100 Nickel

C17500 copper belongs to the copper alloys classification, while grade CZ100 nickel belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C17500 copper and the bottom bar is grade CZ100 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
180
Elongation at Break, % 6.0 to 30
11
Fatigue Strength, MPa 170 to 310
68
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 45
69
Tensile Strength: Ultimate (UTS), MPa 310 to 860
390
Tensile Strength: Yield (Proof), MPa 170 to 760
140

Thermal Properties

Latent Heat of Fusion, J/g 220
310
Maximum Temperature: Mechanical, °C 220
900
Melting Completion (Liquidus), °C 1060
1350
Melting Onset (Solidus), °C 1020
1300
Specific Heat Capacity, J/kg-K 390
450
Thermal Conductivity, W/m-K 200
73
Thermal Expansion, µm/m-K 18
11

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 24 to 53
19
Electrical Conductivity: Equal Weight (Specific), % IACS 24 to 54
19

Otherwise Unclassified Properties

Base Metal Price, % relative 60
60
Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 4.7
10
Embodied Energy, MJ/kg 73
140
Embodied Water, L/kg 320
230

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 30 to 120
35
Resilience: Unit (Modulus of Resilience), kJ/m3 120 to 2390
54
Stiffness to Weight: Axial, points 7.5
12
Stiffness to Weight: Bending, points 18
22
Strength to Weight: Axial, points 9.7 to 27
12
Strength to Weight: Bending, points 11 to 23
14
Thermal Diffusivity, mm2/s 59
19
Thermal Shock Resistance, points 11 to 29
14

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.4 to 0.7
0
Carbon (C), % 0
0 to 1.0
Cobalt (Co), % 2.4 to 2.7
0
Copper (Cu), % 95.6 to 97.2
0 to 1.3
Iron (Fe), % 0 to 0.1
0 to 3.0
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0
95 to 100
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0 to 0.2
0 to 2.0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.5
0