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C17500 Copper vs. C14300 Copper

Both C17500 copper and C14300 copper are copper alloys. They have a very high 96% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C17500 copper and the bottom bar is C14300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 6.0 to 30
2.0 to 42
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 45
43
Shear Strength, MPa 200 to 520
150 to 260
Tensile Strength: Ultimate (UTS), MPa 310 to 860
220 to 460
Tensile Strength: Yield (Proof), MPa 170 to 760
76 to 430

Thermal Properties

Latent Heat of Fusion, J/g 220
210
Maximum Temperature: Mechanical, °C 220
220
Melting Completion (Liquidus), °C 1060
1080
Melting Onset (Solidus), °C 1020
1050
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 200
380
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 24 to 53
96
Electrical Conductivity: Equal Weight (Specific), % IACS 24 to 54
96

Otherwise Unclassified Properties

Base Metal Price, % relative 60
31
Density, g/cm3 8.9
9.0
Embodied Carbon, kg CO2/kg material 4.7
2.6
Embodied Energy, MJ/kg 73
41
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 30 to 120
9.0 to 72
Resilience: Unit (Modulus of Resilience), kJ/m3 120 to 2390
25 to 810
Stiffness to Weight: Axial, points 7.5
7.2
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 9.7 to 27
6.8 to 14
Strength to Weight: Bending, points 11 to 23
9.1 to 15
Thermal Diffusivity, mm2/s 59
110
Thermal Shock Resistance, points 11 to 29
7.8 to 16

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.4 to 0.7
0
Cadmium (Cd), % 0
0.050 to 0.15
Cobalt (Co), % 2.4 to 2.7
0
Copper (Cu), % 95.6 to 97.2
99.9 to 99.95
Iron (Fe), % 0 to 0.1
0
Silicon (Si), % 0 to 0.2
0
Residuals, % 0 to 0.5
0