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C17500 Copper vs. C96300 Copper-nickel

Both C17500 copper and C96300 copper-nickel are copper alloys. They have 77% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C17500 copper and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
130
Elongation at Break, % 6.0 to 30
11
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 45
49
Tensile Strength: Ultimate (UTS), MPa 310 to 860
580
Tensile Strength: Yield (Proof), MPa 170 to 760
430

Thermal Properties

Latent Heat of Fusion, J/g 220
230
Maximum Temperature: Mechanical, °C 220
240
Melting Completion (Liquidus), °C 1060
1200
Melting Onset (Solidus), °C 1020
1150
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 200
37
Thermal Expansion, µm/m-K 18
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 24 to 53
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 24 to 54
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 60
42
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.7
5.1
Embodied Energy, MJ/kg 73
76
Embodied Water, L/kg 320
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 30 to 120
59
Resilience: Unit (Modulus of Resilience), kJ/m3 120 to 2390
720
Stiffness to Weight: Axial, points 7.5
8.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 9.7 to 27
18
Strength to Weight: Bending, points 11 to 23
17
Thermal Diffusivity, mm2/s 59
10
Thermal Shock Resistance, points 11 to 29
20

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.4 to 0.7
0
Carbon (C), % 0
0 to 0.15
Cobalt (Co), % 2.4 to 2.7
0
Copper (Cu), % 95.6 to 97.2
72.3 to 80.8
Iron (Fe), % 0 to 0.1
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0
0.25 to 1.5
Nickel (Ni), % 0
18 to 22
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0 to 0.2
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Residuals, % 0 to 0.5
0 to 0.5