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C17510 Copper vs. CC382H Copper-nickel

Both C17510 copper and CC382H copper-nickel are copper alloys. They have 68% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C17510 copper and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 5.4 to 37
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 44
53
Tensile Strength: Ultimate (UTS), MPa 310 to 860
490
Tensile Strength: Yield (Proof), MPa 120 to 750
290

Thermal Properties

Latent Heat of Fusion, J/g 220
240
Maximum Temperature: Mechanical, °C 220
260
Melting Completion (Liquidus), °C 1070
1180
Melting Onset (Solidus), °C 1030
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 210
30
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22 to 54
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 23 to 54
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 49
41
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.2
5.2
Embodied Energy, MJ/kg 65
76
Embodied Water, L/kg 310
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 39 to 92
85
Resilience: Unit (Modulus of Resilience), kJ/m3 64 to 2410
290
Stiffness to Weight: Axial, points 7.4
8.8
Stiffness to Weight: Bending, points 18
20
Strength to Weight: Axial, points 9.7 to 27
15
Strength to Weight: Bending, points 11 to 23
16
Thermal Diffusivity, mm2/s 60
8.2
Thermal Shock Resistance, points 11 to 30
16

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0 to 0.010
Beryllium (Be), % 0.2 to 0.6
0
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
1.5 to 2.0
Cobalt (Co), % 0 to 0.3
0
Copper (Cu), % 95.9 to 98.4
62.8 to 68.4
Iron (Fe), % 0 to 0.1
0.5 to 1.0
Lead (Pb), % 0
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.5 to 1.0
Nickel (Ni), % 1.4 to 2.2
29 to 32
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0 to 0.2
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 0
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 0.5
0