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C17510 Copper vs. C15500 Copper

Both C17510 copper and C15500 copper are copper alloys. They have a very high 97% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C17510 copper and the bottom bar is C15500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 5.4 to 37
3.0 to 37
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 44
43
Shear Strength, MPa 210 to 500
190 to 320
Tensile Strength: Ultimate (UTS), MPa 310 to 860
280 to 550
Tensile Strength: Yield (Proof), MPa 120 to 750
130 to 530

Thermal Properties

Latent Heat of Fusion, J/g 220
210
Maximum Temperature: Mechanical, °C 220
200
Melting Completion (Liquidus), °C 1070
1080
Melting Onset (Solidus), °C 1030
1080
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 210
350
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22 to 54
90
Electrical Conductivity: Equal Weight (Specific), % IACS 23 to 54
91

Otherwise Unclassified Properties

Base Metal Price, % relative 49
33
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.2
2.7
Embodied Energy, MJ/kg 65
42
Embodied Water, L/kg 310
360

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 39 to 92
15 to 84
Resilience: Unit (Modulus of Resilience), kJ/m3 64 to 2410
72 to 1210
Stiffness to Weight: Axial, points 7.4
7.2
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 9.7 to 27
8.6 to 17
Strength to Weight: Bending, points 11 to 23
11 to 17
Thermal Diffusivity, mm2/s 60
100
Thermal Shock Resistance, points 11 to 30
9.8 to 20

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.2 to 0.6
0
Cobalt (Co), % 0 to 0.3
0
Copper (Cu), % 95.9 to 98.4
99.75 to 99.853
Iron (Fe), % 0 to 0.1
0
Magnesium (Mg), % 0
0.080 to 0.13
Nickel (Ni), % 1.4 to 2.2
0
Phosphorus (P), % 0
0.040 to 0.080
Silicon (Si), % 0 to 0.2
0
Silver (Ag), % 0
0.027 to 0.1
Residuals, % 0 to 0.5
0 to 0.2