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C19010 Copper vs. Solder Alloy 502

C19010 copper belongs to the copper alloys classification, while solder alloy 502 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C19010 copper and the bottom bar is solder alloy 502.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
53
Elongation at Break, % 2.4 to 22
34
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 43
19
Tensile Strength: Ultimate (UTS), MPa 330 to 640
58

Thermal Properties

Latent Heat of Fusion, J/g 210
66
Melting Completion (Liquidus), °C 1060
350
Melting Onset (Solidus), °C 1010
220
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 260
47
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 48 to 63
12
Electrical Conductivity: Equal Weight (Specific), % IACS 48 to 63
15

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.4
Embodied Carbon, kg CO2/kg material 2.7
15
Embodied Energy, MJ/kg 42
260

Common Calculations

Stiffness to Weight: Axial, points 7.3
4.0
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 10 to 20
2.2
Strength to Weight: Bending, points 12 to 18
4.5
Thermal Diffusivity, mm2/s 75
28
Thermal Shock Resistance, points 12 to 23
3.6

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.080
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 97.3 to 99.04
3.5 to 4.5
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0.8 to 1.8
0 to 0.010
Phosphorus (P), % 0.010 to 0.050
0
Silicon (Si), % 0.15 to 0.35
0
Silver (Ag), % 0
0.8 to 1.2
Tin (Sn), % 0
93.8 to 95.7
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.5
0