C19025 Copper vs. CC767S Brass
Both C19025 copper and CC767S brass are copper alloys. They have 62% of their average alloy composition in common. There are 25 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.
For each property being compared, the top bar is C19025 copper and the bottom bar is CC767S brass.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 120 | |
| 110 |
| Elongation at Break, % | 8.0 to 17 | |
| 34 |
| Poisson's Ratio | 0.34 | |
| 0.31 |
| Shear Modulus, GPa | 43 | |
| 40 |
| Tensile Strength: Ultimate (UTS), MPa | 480 to 620 | |
| 430 |
Thermal Properties
| Latent Heat of Fusion, J/g | 210 | |
| 180 |
| Maximum Temperature: Mechanical, °C | 200 | |
| 120 |
| Melting Completion (Liquidus), °C | 1080 | |
| 840 |
| Melting Onset (Solidus), °C | 1020 | |
| 790 |
| Specific Heat Capacity, J/kg-K | 380 | |
| 390 |
| Thermal Conductivity, W/m-K | 160 | |
| 110 |
| Thermal Expansion, µm/m-K | 17 | |
| 21 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 40 | |
| 32 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 40 | |
| 36 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 31 | |
| 23 |
| Density, g/cm3 | 8.9 | |
| 8.0 |
| Embodied Carbon, kg CO2/kg material | 2.8 | |
| 2.7 |
| Embodied Energy, MJ/kg | 44 | |
| 47 |
| Embodied Water, L/kg | 320 | |
| 330 |
Common Calculations
| Stiffness to Weight: Axial, points | 7.2 | |
| 7.3 |
| Stiffness to Weight: Bending, points | 18 | |
| 20 |
| Strength to Weight: Axial, points | 15 to 19 | |
| 15 |
| Strength to Weight: Bending, points | 15 to 18 | |
| 16 |
| Thermal Diffusivity, mm2/s | 47 | |
| 34 |
| Thermal Shock Resistance, points | 17 to 22 | |
| 14 |
Alloy Composition
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| Aluminum (Al), % | 0 | |
| 0.1 to 0.8 |
| Copper (Cu), % | 97.1 to 98.5 | |
| 58 to 64 |
| Iron (Fe), % | 0 | |
| 0 to 0.5 |
| Lead (Pb), % | 0 | |
| 0 to 0.1 |
| Manganese (Mn), % | 0 | |
| 0 to 0.5 |
| Nickel (Ni), % | 0.8 to 1.2 | |
| 0 to 1.0 |
| Phosphorus (P), % | 0.030 to 0.070 | |
| 0 |
| Silicon (Si), % | 0 | |
| 0 to 0.2 |
| Tin (Sn), % | 0.7 to 1.1 | |
| 0 to 0.1 |
| Zinc (Zn), % | 0 to 0.2 | |
| 32.8 to 41.9 |
| Residuals, % | 0 to 0.3 | |
| 0 |