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C19500 Copper vs. C97300 Nickel Silver

Both C19500 copper and C97300 nickel silver are copper alloys. They have 57% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C19500 copper and the bottom bar is C97300 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 2.3 to 38
9.0
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 44
40
Tensile Strength: Ultimate (UTS), MPa 380 to 640
230
Tensile Strength: Yield (Proof), MPa 120 to 600
110

Thermal Properties

Latent Heat of Fusion, J/g 210
180
Maximum Temperature: Mechanical, °C 200
150
Melting Completion (Liquidus), °C 1090
1040
Melting Onset (Solidus), °C 1090
1010
Specific Heat Capacity, J/kg-K 390
370
Thermal Conductivity, W/m-K 200
29
Thermal Expansion, µm/m-K 17
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 50 to 56
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 50 to 57
6.3

Otherwise Unclassified Properties

Base Metal Price, % relative 31
30
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 2.7
3.7
Embodied Energy, MJ/kg 42
59
Embodied Water, L/kg 310
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 14 to 110
18
Resilience: Unit (Modulus of Resilience), kJ/m3 59 to 1530
59
Stiffness to Weight: Axial, points 7.3
7.0
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 12 to 20
7.6
Strength to Weight: Bending, points 13 to 18
9.8
Thermal Diffusivity, mm2/s 58
9.3
Thermal Shock Resistance, points 13 to 23
8.0

Alloy Composition


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Aluminum (Al), % 0 to 0.020
0 to 0.0050
Antimony (Sb), % 0
0 to 0.35
Cobalt (Co), % 0.3 to 1.3
0
Copper (Cu), % 94.9 to 98.6
53 to 58
Iron (Fe), % 1.0 to 2.0
0 to 1.5
Lead (Pb), % 0 to 0.020
8.0 to 11
Nickel (Ni), % 0
11 to 14
Phosphorus (P), % 0.010 to 0.35
0 to 0.050
Silicon (Si), % 0
0 to 0.15
Sulfur (S), % 0
0 to 0.080
Tin (Sn), % 0.1 to 1.0
1.5 to 3.0
Zinc (Zn), % 0 to 0.2
17 to 25
Residuals, % 0 to 0.2
0 to 1.0