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C19800 Copper vs. C82600 Copper

Both C19800 copper and C82600 copper are copper alloys. They have a very high 96% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C19800 copper and the bottom bar is C82600 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 9.0 to 12
1.0 to 20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
46
Tensile Strength: Ultimate (UTS), MPa 430 to 550
570 to 1140
Tensile Strength: Yield (Proof), MPa 420 to 550
320 to 1070

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
300
Melting Completion (Liquidus), °C 1070
950
Melting Onset (Solidus), °C 1050
860
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 260
130
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 61
19
Electrical Conductivity: Equal Weight (Specific), % IACS 62
20

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.7
Embodied Carbon, kg CO2/kg material 2.8
11
Embodied Energy, MJ/kg 43
180
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 52
11 to 97
Resilience: Unit (Modulus of Resilience), kJ/m3 770 to 1320
430 to 4690
Stiffness to Weight: Axial, points 7.2
7.8
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 14 to 17
18 to 36
Strength to Weight: Bending, points 14 to 17
17 to 28
Thermal Diffusivity, mm2/s 75
37
Thermal Shock Resistance, points 15 to 20
19 to 39

Alloy Composition


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Aluminum (Al), % 0
0 to 0.15
Beryllium (Be), % 0
2.3 to 2.6
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
0.35 to 0.65
Copper (Cu), % 95.7 to 99.47
94.9 to 97.2
Iron (Fe), % 0.020 to 0.5
0 to 0.25
Lead (Pb), % 0
0 to 0.020
Magnesium (Mg), % 0.1 to 1.0
0
Nickel (Ni), % 0
0 to 0.2
Phosphorus (P), % 0.010 to 0.1
0
Silicon (Si), % 0
0.2 to 0.35
Tin (Sn), % 0.1 to 1.0
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 0.3 to 1.5
0 to 0.1
Residuals, % 0 to 0.2
0 to 0.5