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C19800 Copper vs. C96300 Copper-nickel

Both C19800 copper and C96300 copper-nickel are copper alloys. They have 77% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C19800 copper and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
130
Elongation at Break, % 9.0 to 12
11
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
49
Tensile Strength: Ultimate (UTS), MPa 430 to 550
580
Tensile Strength: Yield (Proof), MPa 420 to 550
430

Thermal Properties

Latent Heat of Fusion, J/g 210
230
Maximum Temperature: Mechanical, °C 200
240
Melting Completion (Liquidus), °C 1070
1200
Melting Onset (Solidus), °C 1050
1150
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 260
37
Thermal Expansion, µm/m-K 18
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 61
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 62
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 30
42
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.8
5.1
Embodied Energy, MJ/kg 43
76
Embodied Water, L/kg 320
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 52
59
Resilience: Unit (Modulus of Resilience), kJ/m3 770 to 1320
720
Stiffness to Weight: Axial, points 7.2
8.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 14 to 17
18
Strength to Weight: Bending, points 14 to 17
17
Thermal Diffusivity, mm2/s 75
10
Thermal Shock Resistance, points 15 to 20
20

Alloy Composition


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Carbon (C), % 0
0 to 0.15
Copper (Cu), % 95.7 to 99.47
72.3 to 80.8
Iron (Fe), % 0.020 to 0.5
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Magnesium (Mg), % 0.1 to 1.0
0
Manganese (Mn), % 0
0.25 to 1.5
Nickel (Ni), % 0
18 to 22
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0.010 to 0.1
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Tin (Sn), % 0.1 to 1.0
0
Zinc (Zn), % 0.3 to 1.5
0
Residuals, % 0 to 0.2
0 to 0.5