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C21000 Brass vs. CC382H Copper-nickel

Both C21000 brass and CC382H copper-nickel are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C21000 brass and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 2.9 to 50
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
53
Tensile Strength: Ultimate (UTS), MPa 240 to 450
490
Tensile Strength: Yield (Proof), MPa 69 to 440
290

Thermal Properties

Latent Heat of Fusion, J/g 200
240
Maximum Temperature: Mechanical, °C 190
260
Melting Completion (Liquidus), °C 1070
1180
Melting Onset (Solidus), °C 1050
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 230
30
Thermal Expansion, µm/m-K 18
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 56
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 57
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 30
41
Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.2
Embodied Energy, MJ/kg 42
76
Embodied Water, L/kg 310
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 13 to 100
85
Resilience: Unit (Modulus of Resilience), kJ/m3 21 to 830
290
Stiffness to Weight: Axial, points 7.2
8.8
Stiffness to Weight: Bending, points 18
20
Strength to Weight: Axial, points 7.4 to 14
15
Strength to Weight: Bending, points 9.6 to 15
16
Thermal Diffusivity, mm2/s 69
8.2
Thermal Shock Resistance, points 8.1 to 15
16

Alloy Composition


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Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
1.5 to 2.0
Copper (Cu), % 94 to 96
62.8 to 68.4
Iron (Fe), % 0 to 0.050
0.5 to 1.0
Lead (Pb), % 0 to 0.030
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.5 to 1.0
Nickel (Ni), % 0
29 to 32
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 3.7 to 6.0
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 0.2
0