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C23000 Brass vs. C82000 Copper

Both C23000 brass and C82000 copper are copper alloys. They have 85% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C23000 brass and the bottom bar is C82000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 2.9 to 47
8.0 to 20
Poisson's Ratio 0.33
0.34
Rockwell B Hardness 48 to 87
55 to 95
Shear Modulus, GPa 42
45
Tensile Strength: Ultimate (UTS), MPa 280 to 590
350 to 690
Tensile Strength: Yield (Proof), MPa 83 to 480
140 to 520

Thermal Properties

Latent Heat of Fusion, J/g 190
220
Maximum Temperature: Mechanical, °C 170
220
Melting Completion (Liquidus), °C 1030
1090
Melting Onset (Solidus), °C 990
970
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 160
260
Thermal Expansion, µm/m-K 19
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 37
45
Electrical Conductivity: Equal Weight (Specific), % IACS 39
46

Otherwise Unclassified Properties

Base Metal Price, % relative 28
60
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.0
Embodied Energy, MJ/kg 43
77
Embodied Water, L/kg 310
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 6.2 to 260
51 to 55
Resilience: Unit (Modulus of Resilience), kJ/m3 31 to 1040
80 to 1120
Stiffness to Weight: Axial, points 7.2
7.5
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 8.9 to 19
11 to 22
Strength to Weight: Bending, points 11 to 18
12 to 20
Thermal Diffusivity, mm2/s 48
76
Thermal Shock Resistance, points 9.4 to 20
12 to 24

Alloy Composition


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Aluminum (Al), % 0
0 to 0.1
Beryllium (Be), % 0
0.45 to 0.8
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
2.2 to 2.7
Copper (Cu), % 84 to 86
95.2 to 97.4
Iron (Fe), % 0 to 0.050
0 to 0.1
Lead (Pb), % 0 to 0.050
0 to 0.020
Nickel (Ni), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.15
Tin (Sn), % 0
0 to 0.1
Zinc (Zn), % 13.7 to 16
0 to 0.1
Residuals, % 0 to 0.2
0 to 0.5