C24000 Brass vs. C18900 Copper
Both C24000 brass and C18900 copper are copper alloys. They have 80% of their average alloy composition in common. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.
For each property being compared, the top bar is C24000 brass and the bottom bar is C18900 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 110 | |
| 120 |
| Poisson's Ratio | 0.32 | |
| 0.34 |
| Shear Modulus, GPa | 42 | |
| 43 |
| Tensile Strength: Ultimate (UTS), MPa | 310 to 640 | |
| 260 to 500 |
Thermal Properties
| Latent Heat of Fusion, J/g | 190 | |
| 210 |
| Maximum Temperature: Mechanical, °C | 160 | |
| 200 |
| Melting Completion (Liquidus), °C | 1000 | |
| 1080 |
| Melting Onset (Solidus), °C | 970 | |
| 1020 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 390 |
| Thermal Conductivity, W/m-K | 140 | |
| 130 |
| Thermal Expansion, µm/m-K | 19 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 32 | |
| 30 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 34 | |
| 30 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 27 | |
| 31 |
| Density, g/cm3 | 8.5 | |
| 8.9 |
| Embodied Carbon, kg CO2/kg material | 2.6 | |
| 2.7 |
| Embodied Energy, MJ/kg | 43 | |
| 42 |
| Embodied Water, L/kg | 320 | |
| 310 |
Common Calculations
| Stiffness to Weight: Axial, points | 7.2 | |
| 7.2 |
| Stiffness to Weight: Bending, points | 19 | |
| 18 |
| Strength to Weight: Axial, points | 10 to 21 | |
| 8.2 to 16 |
| Strength to Weight: Bending, points | 12 to 20 | |
| 10 to 16 |
| Thermal Diffusivity, mm2/s | 43 | |
| 38 |
| Thermal Shock Resistance, points | 10 to 22 | |
| 9.3 to 18 |
Alloy Composition
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| Aluminum (Al), % | 0 | |
| 0 to 0.010 |
| Copper (Cu), % | 78.5 to 81.5 | |
| 97.7 to 99.15 |
| Iron (Fe), % | 0 to 0.050 | |
| 0 |
| Lead (Pb), % | 0 to 0.050 | |
| 0 to 0.020 |
| Manganese (Mn), % | 0 | |
| 0.1 to 0.3 |
| Phosphorus (P), % | 0 | |
| 0 to 0.050 |
| Silicon (Si), % | 0 | |
| 0.15 to 0.4 |
| Tin (Sn), % | 0 | |
| 0.6 to 0.9 |
| Zinc (Zn), % | 18.2 to 21.5 | |
| 0 to 0.1 |
| Residuals, % | 0 to 0.2 | |
| 0 to 0.5 |