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C26000 Brass vs. CC383H Copper-nickel

Both C26000 brass and CC383H copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C26000 brass and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 2.5 to 66
20
Poisson's Ratio 0.31
0.33
Shear Modulus, GPa 41
52
Tensile Strength: Ultimate (UTS), MPa 320 to 680
490
Tensile Strength: Yield (Proof), MPa 110 to 570
260

Thermal Properties

Latent Heat of Fusion, J/g 180
240
Maximum Temperature: Mechanical, °C 140
260
Melting Completion (Liquidus), °C 950
1180
Melting Onset (Solidus), °C 920
1130
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 120
29
Thermal Expansion, µm/m-K 20
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 31
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 25
44
Density, g/cm3 8.2
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.7
Embodied Energy, MJ/kg 45
83
Embodied Water, L/kg 320
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 6.1 to 420
84
Resilience: Unit (Modulus of Resilience), kJ/m3 51 to 1490
250
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 11 to 23
15
Strength to Weight: Bending, points 13 to 21
16
Thermal Diffusivity, mm2/s 38
8.1
Thermal Shock Resistance, points 11 to 23
17

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0 to 0.0059
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 68.5 to 71.5
64 to 69.1
Iron (Fe), % 0 to 0.050
0.5 to 1.5
Lead (Pb), % 0 to 0.070
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Zinc (Zn), % 28.1 to 31.5
0 to 0.5
Residuals, % 0 to 0.3
0