C55283 Copper vs. Solder Alloy 801
C55283 copper belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.
For each property being compared, the top bar is C55283 copper and the bottom bar is solder alloy 801.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 100 | |
| 53 |
| Poisson's Ratio | 0.34 | |
| 0.35 |
| Shear Modulus, GPa | 39 | |
| 20 |
| Tensile Strength: Ultimate (UTS), MPa | 190 | |
| 55 |
Thermal Properties
| Latent Heat of Fusion, J/g | 190 | |
| 64 |
| Melting Completion (Liquidus), °C | 720 | |
| 200 |
| Melting Onset (Solidus), °C | 640 | |
| 200 |
| Specific Heat Capacity, J/kg-K | 400 | |
| 240 |
| Thermal Expansion, µm/m-K | 16 | |
| 22 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.6 | |
| 7.2 |
| Embodied Carbon, kg CO2/kg material | 7.9 | |
| 14 |
| Embodied Energy, MJ/kg | 120 | |
| 240 |
Common Calculations
| Stiffness to Weight: Axial, points | 6.8 | |
| 4.1 |
| Stiffness to Weight: Bending, points | 18 | |
| 17 |
| Strength to Weight: Axial, points | 6.1 | |
| 2.1 |
| Strength to Weight: Bending, points | 8.5 | |
| 4.4 |
| Thermal Shock Resistance, points | 8.0 | |
| 3.3 |
Alloy Composition
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| Aluminum (Al), % | 0 | |
| 0 to 0.0010 |
| Antimony (Sb), % | 0 | |
| 0 to 0.1 |
| Arsenic (As), % | 0 | |
| 0 to 0.030 |
| Bismuth (Bi), % | 0 | |
| 0 to 0.1 |
| Cadmium (Cd), % | 0 | |
| 0 to 0.0020 |
| Copper (Cu), % | 86.2 to 87.2 | |
| 0 to 0.050 |
| Gold (Au), % | 0 | |
| 0 to 0.050 |
| Indium (In), % | 0 | |
| 0 to 0.1 |
| Iron (Fe), % | 0 | |
| 0 to 0.020 |
| Lead (Pb), % | 0 | |
| 0 to 0.070 |
| Nickel (Ni), % | 0 | |
| 0 to 0.010 |
| Phosphorus (P), % | 7.0 to 7.5 | |
| 0 |
| Silver (Ag), % | 5.8 to 6.2 | |
| 0 to 0.1 |
| Tin (Sn), % | 0 | |
| 89.9 to 91.5 |
| Zinc (Zn), % | 0 | |
| 8.5 to 9.5 |
| Residuals, % | 0 to 0.15 | |
| 0 |