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C66200 Brass vs. CC383H Copper-nickel

Both C66200 brass and CC383H copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C66200 brass and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 8.0 to 15
20
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 42
52
Tensile Strength: Ultimate (UTS), MPa 450 to 520
490
Tensile Strength: Yield (Proof), MPa 410 to 480
260

Thermal Properties

Latent Heat of Fusion, J/g 200
240
Maximum Temperature: Mechanical, °C 180
260
Melting Completion (Liquidus), °C 1070
1180
Melting Onset (Solidus), °C 1030
1130
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 150
29
Thermal Expansion, µm/m-K 18
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 35
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 36
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 29
44
Density, g/cm3 8.7
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.7
Embodied Energy, MJ/kg 43
83
Embodied Water, L/kg 320
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 66
84
Resilience: Unit (Modulus of Resilience), kJ/m3 760 to 1030
250
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 14 to 17
15
Strength to Weight: Bending, points 15 to 16
16
Thermal Diffusivity, mm2/s 45
8.1
Thermal Shock Resistance, points 16 to 18
17

Alloy Composition


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Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 86.6 to 91
64 to 69.1
Iron (Fe), % 0 to 0.050
0.5 to 1.5
Lead (Pb), % 0 to 0.050
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0.3 to 1.0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0.050 to 0.2
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Tin (Sn), % 0.2 to 0.7
0
Zinc (Zn), % 6.5 to 12.9
0 to 0.5
Residuals, % 0 to 0.5
0