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C66700 Brass vs. CC382H Copper-nickel

Both C66700 brass and CC382H copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C66700 brass and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 2.0 to 58
20
Poisson's Ratio 0.31
0.33
Shear Modulus, GPa 41
53
Tensile Strength: Ultimate (UTS), MPa 340 to 690
490
Tensile Strength: Yield (Proof), MPa 100 to 640
290

Thermal Properties

Latent Heat of Fusion, J/g 180
240
Maximum Temperature: Mechanical, °C 140
260
Melting Completion (Liquidus), °C 1090
1180
Melting Onset (Solidus), °C 1050
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 97
30
Thermal Expansion, µm/m-K 20
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 17
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 19
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 25
41
Density, g/cm3 8.2
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.2
Embodied Energy, MJ/kg 45
76
Embodied Water, L/kg 320
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 13 to 150
85
Resilience: Unit (Modulus of Resilience), kJ/m3 49 to 1900
290
Stiffness to Weight: Axial, points 7.3
8.8
Stiffness to Weight: Bending, points 19
20
Strength to Weight: Axial, points 11 to 23
15
Strength to Weight: Bending, points 13 to 21
16
Thermal Diffusivity, mm2/s 30
8.2
Thermal Shock Resistance, points 11 to 23
16

Alloy Composition


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Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
1.5 to 2.0
Copper (Cu), % 68.5 to 71.5
62.8 to 68.4
Iron (Fe), % 0 to 0.1
0.5 to 1.0
Lead (Pb), % 0 to 0.070
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0.8 to 1.5
0.5 to 1.0
Nickel (Ni), % 0
29 to 32
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 26.3 to 30.7
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 0.5
0