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C66700 Brass vs. C82800 Copper

Both C66700 brass and C82800 copper are copper alloys. They have 70% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C66700 brass and the bottom bar is C82800 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 2.0 to 58
1.0 to 20
Poisson's Ratio 0.31
0.33
Rockwell B Hardness 57 to 93
45 to 85
Shear Modulus, GPa 41
46
Tensile Strength: Ultimate (UTS), MPa 340 to 690
670 to 1140
Tensile Strength: Yield (Proof), MPa 100 to 640
380 to 1000

Thermal Properties

Latent Heat of Fusion, J/g 180
240
Maximum Temperature: Mechanical, °C 140
310
Melting Completion (Liquidus), °C 1090
930
Melting Onset (Solidus), °C 1050
890
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 97
120
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 17
18
Electrical Conductivity: Equal Weight (Specific), % IACS 19
19

Otherwise Unclassified Properties

Density, g/cm3 8.2
8.7
Embodied Carbon, kg CO2/kg material 2.7
12
Embodied Energy, MJ/kg 45
190
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 13 to 150
11 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 49 to 1900
590 to 4080
Stiffness to Weight: Axial, points 7.3
7.8
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 11 to 23
21 to 36
Strength to Weight: Bending, points 13 to 21
20 to 28
Thermal Diffusivity, mm2/s 30
36
Thermal Shock Resistance, points 11 to 23
23 to 39

Alloy Composition


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Aluminum (Al), % 0
0 to 0.15
Beryllium (Be), % 0
2.5 to 2.9
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
0.15 to 0.7
Copper (Cu), % 68.5 to 71.5
94.6 to 97.2
Iron (Fe), % 0 to 0.1
0 to 0.25
Lead (Pb), % 0 to 0.070
0 to 0.020
Manganese (Mn), % 0.8 to 1.5
0
Nickel (Ni), % 0
0 to 0.2
Silicon (Si), % 0
0.2 to 0.35
Tin (Sn), % 0
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 26.3 to 30.7
0 to 0.1
Residuals, % 0 to 0.5
0 to 0.5