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C70260 Copper vs. Grade M30H Nickel

C70260 copper belongs to the copper alloys classification, while grade M30H nickel belongs to the nickel alloys. They have a modest 32% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C70260 copper and the bottom bar is grade M30H nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
160
Elongation at Break, % 9.5 to 19
11
Poisson's Ratio 0.34
0.32
Shear Modulus, GPa 44
61
Tensile Strength: Ultimate (UTS), MPa 520 to 760
770
Tensile Strength: Yield (Proof), MPa 410 to 650
470

Thermal Properties

Latent Heat of Fusion, J/g 220
320
Maximum Temperature: Mechanical, °C 200
900
Melting Completion (Liquidus), °C 1060
1250
Melting Onset (Solidus), °C 1040
1200
Specific Heat Capacity, J/kg-K 390
440
Thermal Conductivity, W/m-K 160
22
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 40 to 50
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 40 to 51
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 31
50
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 2.7
7.7
Embodied Energy, MJ/kg 43
110
Embodied Water, L/kg 310
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 46 to 140
75
Resilience: Unit (Modulus of Resilience), kJ/m3 710 to 1810
700
Stiffness to Weight: Axial, points 7.3
10
Stiffness to Weight: Bending, points 18
21
Strength to Weight: Axial, points 16 to 24
25
Strength to Weight: Bending, points 16 to 21
22
Thermal Diffusivity, mm2/s 45
5.7
Thermal Shock Resistance, points 18 to 27
27

Alloy Composition


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Carbon (C), % 0
0 to 0.3
Copper (Cu), % 95.8 to 98.8
27 to 33
Iron (Fe), % 0
0 to 3.5
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 1.0 to 3.0
57.9 to 70.3
Phosphorus (P), % 0 to 0.010
0 to 0.030
Silicon (Si), % 0.2 to 0.7
2.7 to 3.7
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.5
0