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C70260 Copper vs. C12900 Copper

Both C70260 copper and C12900 copper are copper alloys. They have a very high 97% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C70260 copper and the bottom bar is C12900 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 9.5 to 19
2.8 to 50
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 44
43
Shear Strength, MPa 320 to 450
150 to 210
Tensile Strength: Ultimate (UTS), MPa 520 to 760
220 to 420
Tensile Strength: Yield (Proof), MPa 410 to 650
75 to 380

Thermal Properties

Latent Heat of Fusion, J/g 220
210
Maximum Temperature: Mechanical, °C 200
200
Melting Completion (Liquidus), °C 1060
1080
Melting Onset (Solidus), °C 1040
1030
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 160
380
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 40 to 50
98
Electrical Conductivity: Equal Weight (Specific), % IACS 40 to 51
98

Otherwise Unclassified Properties

Base Metal Price, % relative 31
32
Density, g/cm3 8.9
9.0
Embodied Carbon, kg CO2/kg material 2.7
2.6
Embodied Energy, MJ/kg 43
41
Embodied Water, L/kg 310
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 46 to 140
11 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 710 to 1810
24 to 640
Stiffness to Weight: Axial, points 7.3
7.2
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 16 to 24
6.8 to 13
Strength to Weight: Bending, points 16 to 21
9.1 to 14
Thermal Diffusivity, mm2/s 45
110
Thermal Shock Resistance, points 18 to 27
7.8 to 15

Alloy Composition


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Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Copper (Cu), % 95.8 to 98.8
99.88 to 100
Lead (Pb), % 0
0 to 0.0040
Nickel (Ni), % 1.0 to 3.0
0 to 0.050
Phosphorus (P), % 0 to 0.010
0
Silicon (Si), % 0.2 to 0.7
0
Silver (Ag), % 0
0 to 0.054
Tellurium (Te), % 0
0 to 0.025
Residuals, % 0 to 0.5
0