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C70260 Copper vs. S32053 Stainless Steel

C70260 copper belongs to the copper alloys classification, while S32053 stainless steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C70260 copper and the bottom bar is S32053 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
210
Elongation at Break, % 9.5 to 19
46
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 44
80
Shear Strength, MPa 320 to 450
510
Tensile Strength: Ultimate (UTS), MPa 520 to 760
730
Tensile Strength: Yield (Proof), MPa 410 to 650
330

Thermal Properties

Latent Heat of Fusion, J/g 220
310
Maximum Temperature: Mechanical, °C 200
1100
Melting Completion (Liquidus), °C 1060
1450
Melting Onset (Solidus), °C 1040
1400
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 160
13
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 40 to 50
1.8
Electrical Conductivity: Equal Weight (Specific), % IACS 40 to 51
2.0

Otherwise Unclassified Properties

Base Metal Price, % relative 31
33
Density, g/cm3 8.9
8.1
Embodied Carbon, kg CO2/kg material 2.7
6.1
Embodied Energy, MJ/kg 43
83
Embodied Water, L/kg 310
210

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 46 to 140
270
Resilience: Unit (Modulus of Resilience), kJ/m3 710 to 1810
270
Stiffness to Weight: Axial, points 7.3
14
Stiffness to Weight: Bending, points 18
24
Strength to Weight: Axial, points 16 to 24
25
Strength to Weight: Bending, points 16 to 21
22
Thermal Diffusivity, mm2/s 45
3.3
Thermal Shock Resistance, points 18 to 27
16

Alloy Composition


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Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
22 to 24
Copper (Cu), % 95.8 to 98.8
0
Iron (Fe), % 0
41.7 to 48.8
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
5.0 to 6.0
Nickel (Ni), % 1.0 to 3.0
24 to 26
Nitrogen (N), % 0
0.17 to 0.22
Phosphorus (P), % 0 to 0.010
0 to 0.030
Silicon (Si), % 0.2 to 0.7
0 to 1.0
Sulfur (S), % 0
0 to 0.010
Residuals, % 0 to 0.5
0