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C70400 Copper-nickel vs. Solder Alloy 801

C70400 copper-nickel belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C70400 copper-nickel and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
53
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 45
20
Tensile Strength: Ultimate (UTS), MPa 300 to 310
55

Thermal Properties

Latent Heat of Fusion, J/g 210
64
Melting Completion (Liquidus), °C 1120
200
Melting Onset (Solidus), °C 1060
200
Specific Heat Capacity, J/kg-K 390
240
Thermal Conductivity, W/m-K 64
61
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
15
Electrical Conductivity: Equal Weight (Specific), % IACS 14
19

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.2
Embodied Carbon, kg CO2/kg material 3.0
14
Embodied Energy, MJ/kg 47
240
Embodied Water, L/kg 300
1140

Common Calculations

Stiffness to Weight: Axial, points 7.5
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 9.3 to 9.8
2.1
Strength to Weight: Bending, points 11 to 12
4.4
Thermal Diffusivity, mm2/s 18
36
Thermal Shock Resistance, points 10 to 11
3.3

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 89.8 to 93.6
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.3 to 1.7
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Manganese (Mn), % 0.3 to 0.8
0
Nickel (Ni), % 4.8 to 6.2
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0 to 1.0
8.5 to 9.5
Residuals, % 0 to 0.5
0