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C70600 Copper-nickel vs. Solder Alloy 111

C70600 copper-nickel belongs to the copper alloys classification, while solder alloy 111 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C70600 copper-nickel and the bottom bar is solder alloy 111.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
33
Elongation at Break, % 3.0 to 34
35
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 46
12
Tensile Strength: Ultimate (UTS), MPa 290 to 570
41

Thermal Properties

Latent Heat of Fusion, J/g 220
41
Melting Completion (Liquidus), °C 1150
220
Melting Onset (Solidus), °C 1100
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 44
48
Thermal Expansion, µm/m-K 17
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
11
Electrical Conductivity: Equal Weight (Specific), % IACS 9.9
11

Otherwise Unclassified Properties

Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 3.4
9.4
Embodied Energy, MJ/kg 51
160
Embodied Water, L/kg 300
830

Common Calculations

Stiffness to Weight: Axial, points 7.7
2.0
Stiffness to Weight: Bending, points 19
12
Strength to Weight: Axial, points 9.1 to 18
1.2
Strength to Weight: Bending, points 11 to 17
2.8
Thermal Diffusivity, mm2/s 13
29
Thermal Shock Resistance, points 9.8 to 19
3.5

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 84.7 to 90
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.0 to 1.8
0 to 0.020
Lead (Pb), % 0 to 0.050
48.8 to 50.5
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 9.0 to 11
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0