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C70620 Copper-nickel vs. Solder Alloy 123

C70620 copper-nickel belongs to the copper alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C70620 copper-nickel and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
18
Poisson's Ratio 0.34
0.44
Shear Modulus, GPa 46
6.2
Tensile Strength: Ultimate (UTS), MPa 300 to 570
28

Thermal Properties

Latent Heat of Fusion, J/g 220
26
Melting Completion (Liquidus), °C 1120
310
Melting Onset (Solidus), °C 1060
300
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 49
23
Thermal Expansion, µm/m-K 17
29

Otherwise Unclassified Properties

Base Metal Price, % relative 33
75
Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 3.4
4.5
Embodied Energy, MJ/kg 51
74
Embodied Water, L/kg 300
500

Common Calculations

Stiffness to Weight: Axial, points 7.7
0.9
Stiffness to Weight: Bending, points 19
7.8
Strength to Weight: Axial, points 9.3 to 18
0.69
Strength to Weight: Bending, points 11 to 17
1.8
Thermal Diffusivity, mm2/s 14
16
Thermal Shock Resistance, points 10 to 20
3.8

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Carbon (C), % 0 to 0.050
0
Copper (Cu), % 86.5 to 90
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.0 to 1.8
0 to 0.020
Lead (Pb), % 0 to 0.020
93.5 to 95.5
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 9.0 to 11
0 to 0.010
Phosphorus (P), % 0 to 0.2
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.020
0
Tin (Sn), % 0
4.5 to 5.5
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.5
0