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C70700 Copper-nickel vs. EN 1.1203 Steel

C70700 copper-nickel belongs to the copper alloys classification, while EN 1.1203 steel belongs to the iron alloys. There are 30 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is EN 1.1203 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 73
200 to 230
Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 39
12 to 15
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 46
72
Shear Strength, MPa 220
420 to 480
Tensile Strength: Ultimate (UTS), MPa 320
690 to 780
Tensile Strength: Yield (Proof), MPa 110
340 to 480

Thermal Properties

Latent Heat of Fusion, J/g 220
250
Maximum Temperature: Mechanical, °C 220
400
Melting Completion (Liquidus), °C 1120
1460
Melting Onset (Solidus), °C 1060
1420
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 59
48
Thermal Expansion, µm/m-K 16
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
7.2
Electrical Conductivity: Equal Weight (Specific), % IACS 12
8.3

Otherwise Unclassified Properties

Base Metal Price, % relative 34
2.1
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 3.4
1.4
Embodied Energy, MJ/kg 52
19
Embodied Water, L/kg 300
47

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
69 to 100
Resilience: Unit (Modulus of Resilience), kJ/m3 51
310 to 610
Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 10
25 to 28
Strength to Weight: Bending, points 12
22 to 24
Thermal Diffusivity, mm2/s 17
13
Thermal Shock Resistance, points 12
22 to 25

Alloy Composition


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Carbon (C), % 0
0.52 to 0.6
Chromium (Cr), % 0
0 to 0.4
Copper (Cu), % 88.5 to 90.5
0
Iron (Fe), % 0 to 0.050
97.1 to 98.9
Manganese (Mn), % 0 to 0.5
0.6 to 0.9
Molybdenum (Mo), % 0
0 to 0.1
Nickel (Ni), % 9.5 to 10.5
0 to 0.4
Phosphorus (P), % 0
0 to 0.035
Silicon (Si), % 0
0 to 0.4
Sulfur (S), % 0
0 to 0.035
Residuals, % 0 to 0.5
0