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C70700 Copper-nickel vs. EN 1.4854 Stainless Steel

C70700 copper-nickel belongs to the copper alloys classification, while EN 1.4854 stainless steel belongs to the iron alloys. There are 30 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is EN 1.4854 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 73
180
Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 39
45
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 46
78
Shear Strength, MPa 220
520
Tensile Strength: Ultimate (UTS), MPa 320
750
Tensile Strength: Yield (Proof), MPa 110
340

Thermal Properties

Latent Heat of Fusion, J/g 220
330
Maximum Temperature: Mechanical, °C 220
1170
Melting Completion (Liquidus), °C 1120
1370
Melting Onset (Solidus), °C 1060
1330
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 59
11
Thermal Expansion, µm/m-K 16
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
1.7
Electrical Conductivity: Equal Weight (Specific), % IACS 12
2.0

Otherwise Unclassified Properties

Base Metal Price, % relative 34
34
Density, g/cm3 8.9
7.9
Embodied Carbon, kg CO2/kg material 3.4
5.7
Embodied Energy, MJ/kg 52
81
Embodied Water, L/kg 300
220

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
270
Resilience: Unit (Modulus of Resilience), kJ/m3 51
280
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 10
26
Strength to Weight: Bending, points 12
23
Thermal Diffusivity, mm2/s 17
2.9
Thermal Shock Resistance, points 12
18

Alloy Composition


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Carbon (C), % 0
0.040 to 0.080
Cerium (Ce), % 0
0.030 to 0.080
Chromium (Cr), % 0
24 to 26
Copper (Cu), % 88.5 to 90.5
0
Iron (Fe), % 0 to 0.050
33.6 to 40.6
Manganese (Mn), % 0 to 0.5
0 to 2.0
Nickel (Ni), % 9.5 to 10.5
34 to 36
Nitrogen (N), % 0
0.12 to 0.2
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0
1.2 to 2.0
Sulfur (S), % 0
0 to 0.015
Residuals, % 0 to 0.5
0