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C70700 Copper-nickel vs. S64512 Stainless Steel

C70700 copper-nickel belongs to the copper alloys classification, while S64512 stainless steel belongs to the iron alloys. There are 30 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C70700 copper-nickel and the bottom bar is S64512 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 73
330
Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 39
17
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 46
76
Shear Strength, MPa 220
700
Tensile Strength: Ultimate (UTS), MPa 320
1140
Tensile Strength: Yield (Proof), MPa 110
890

Thermal Properties

Latent Heat of Fusion, J/g 220
270
Maximum Temperature: Mechanical, °C 220
750
Melting Completion (Liquidus), °C 1120
1460
Melting Onset (Solidus), °C 1060
1420
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 59
28
Thermal Expansion, µm/m-K 16
10

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
3.6
Electrical Conductivity: Equal Weight (Specific), % IACS 12
4.1

Otherwise Unclassified Properties

Base Metal Price, % relative 34
10
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 3.4
3.3
Embodied Energy, MJ/kg 52
47
Embodied Water, L/kg 300
110

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
180
Resilience: Unit (Modulus of Resilience), kJ/m3 51
2020
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 10
40
Strength to Weight: Bending, points 12
31
Thermal Diffusivity, mm2/s 17
7.5
Thermal Shock Resistance, points 12
42

Alloy Composition


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Carbon (C), % 0
0.080 to 0.15
Chromium (Cr), % 0
11 to 12.5
Copper (Cu), % 88.5 to 90.5
0
Iron (Fe), % 0 to 0.050
80.6 to 84.7
Manganese (Mn), % 0 to 0.5
0.5 to 0.9
Molybdenum (Mo), % 0
1.5 to 2.0
Nickel (Ni), % 9.5 to 10.5
2.0 to 3.0
Nitrogen (N), % 0
0.010 to 0.050
Phosphorus (P), % 0
0 to 0.025
Silicon (Si), % 0
0 to 0.35
Sulfur (S), % 0
0 to 0.025
Vanadium (V), % 0
0.25 to 0.4
Residuals, % 0 to 0.5
0