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C71000 Copper-nickel vs. Solder Alloy 801

C71000 copper-nickel belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C71000 copper-nickel and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
53
Poisson's Ratio 0.33
0.35
Shear Modulus, GPa 49
20
Tensile Strength: Ultimate (UTS), MPa 320 to 560
55

Thermal Properties

Latent Heat of Fusion, J/g 230
64
Melting Completion (Liquidus), °C 1200
200
Melting Onset (Solidus), °C 1150
200
Specific Heat Capacity, J/kg-K 400
240
Thermal Conductivity, W/m-K 43
61
Thermal Expansion, µm/m-K 15
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.5
15
Electrical Conductivity: Equal Weight (Specific), % IACS 6.6
19

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.2
Embodied Carbon, kg CO2/kg material 4.3
14
Embodied Energy, MJ/kg 63
240
Embodied Water, L/kg 290
1140

Common Calculations

Stiffness to Weight: Axial, points 8.2
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 10 to 18
2.1
Strength to Weight: Bending, points 12 to 17
4.4
Thermal Diffusivity, mm2/s 12
36
Thermal Shock Resistance, points 12 to 20
3.3

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 73.5 to 80.5
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.5 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 19 to 23
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0 to 1.0
8.5 to 9.5
Residuals, % 0 to 0.5
0