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C71500 Copper-nickel vs. Solder Alloy 142

C71500 copper-nickel belongs to the copper alloys classification, while solder alloy 142 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C71500 copper-nickel and the bottom bar is solder alloy 142.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
33
Poisson's Ratio 0.33
0.4
Shear Modulus, GPa 52
12
Tensile Strength: Ultimate (UTS), MPa 380 to 620
43

Thermal Properties

Latent Heat of Fusion, J/g 230
42
Melting Completion (Liquidus), °C 1240
210
Melting Onset (Solidus), °C 1170
180
Specific Heat Capacity, J/kg-K 400
170
Thermal Conductivity, W/m-K 28
45
Thermal Expansion, µm/m-K 16
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.6
11
Electrical Conductivity: Equal Weight (Specific), % IACS 4.7
11

Otherwise Unclassified Properties

Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 5.1
9.4
Embodied Energy, MJ/kg 74
160
Embodied Water, L/kg 280
890

Common Calculations

Stiffness to Weight: Axial, points 8.6
2.0
Stiffness to Weight: Bending, points 19
11
Strength to Weight: Axial, points 12 to 19
1.3
Strength to Weight: Bending, points 13 to 18
2.9
Thermal Diffusivity, mm2/s 7.7
28
Thermal Shock Resistance, points 12 to 20
3.7

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.5 to 3.5
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 63.5 to 70.6
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.050
47.4 to 50
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 29 to 33
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
47.5 to 48.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0