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C71640 Copper-nickel vs. Solder Alloy 103

C71640 copper-nickel belongs to the copper alloys classification, while solder alloy 103 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C71640 copper-nickel and the bottom bar is solder alloy 103.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
37
Poisson's Ratio 0.33
0.39
Shear Modulus, GPa 52
13
Tensile Strength: Ultimate (UTS), MPa 490 to 630
52

Thermal Properties

Latent Heat of Fusion, J/g 240
45
Melting Completion (Liquidus), °C 1180
190
Melting Onset (Solidus), °C 1120
180
Specific Heat Capacity, J/kg-K 410
180
Thermal Conductivity, W/m-K 29
50
Thermal Expansion, µm/m-K 15
24

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.0
11
Electrical Conductivity: Equal Weight (Specific), % IACS 7.1
12

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.0
10
Embodied Energy, MJ/kg 73
180
Embodied Water, L/kg 280
910

Common Calculations

Stiffness to Weight: Axial, points 8.7
2.3
Stiffness to Weight: Bending, points 20
12
Strength to Weight: Axial, points 15 to 20
1.6
Strength to Weight: Bending, points 16 to 18
3.5
Thermal Diffusivity, mm2/s 8.2
30
Thermal Shock Resistance, points 16 to 21
4.3

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 61.7 to 67.8
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.7 to 2.3
0 to 0.020
Lead (Pb), % 0 to 0.050
38.8 to 40.5
Manganese (Mn), % 1.5 to 2.5
0
Nickel (Ni), % 29 to 32
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
59.5 to 60.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0