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C71640 Copper-nickel vs. Solder Alloy 112

C71640 copper-nickel belongs to the copper alloys classification, while solder alloy 112 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C71640 copper-nickel and the bottom bar is solder alloy 112.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
33
Poisson's Ratio 0.33
0.4
Shear Modulus, GPa 52
12
Tensile Strength: Ultimate (UTS), MPa 490 to 630
41

Thermal Properties

Latent Heat of Fusion, J/g 240
41
Melting Completion (Liquidus), °C 1180
220
Melting Onset (Solidus), °C 1120
180
Specific Heat Capacity, J/kg-K 410
180
Thermal Conductivity, W/m-K 29
49
Thermal Expansion, µm/m-K 15
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.0
11
Electrical Conductivity: Equal Weight (Specific), % IACS 7.1
10

Otherwise Unclassified Properties

Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 5.0
9.4
Embodied Energy, MJ/kg 73
160
Embodied Water, L/kg 280
830

Common Calculations

Stiffness to Weight: Axial, points 8.7
2.0
Stiffness to Weight: Bending, points 20
11
Strength to Weight: Axial, points 15 to 20
1.2
Strength to Weight: Bending, points 16 to 18
2.8
Thermal Diffusivity, mm2/s 8.2
30
Thermal Shock Resistance, points 16 to 21
3.5

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.050
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 61.7 to 67.8
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.7 to 2.3
0 to 0.020
Lead (Pb), % 0 to 0.050
49 to 50.5
Manganese (Mn), % 1.5 to 2.5
0
Nickel (Ni), % 29 to 32
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0